| 第 41 卷第 5 期 |  | Vol. 41 No. 5 | | 2011 年 10 月 | Oct 2011 |
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所属栏目：功能材料
环氧树脂E-44反应增容尼龙6／废印刷电路板非金属粉复合材料的力学性能和热变形温度研究 |
| 欧阳杰1，李 渊1，王 曦1，孟 勇2，苏胜培1，2*
（1． 资源精细化与先进材料湖南省普通高校重点实验室，湖南 长沙 410081；2． 湖南师范大学 资源循环综合技术研究中心，湖南 长沙 410081） |
| 摘 要：用环氧树脂E-44作为反应性的增容剂，采用熔融共混方法制备了尼龙6（PA6）／废印刷电路板非金属粉（N-PCB）复合材料。研究了E-44用量、挤出温度以及N-PCB粉末的粒径大小对PA6／N-PCB复合材料力学性能和热变形温度的影响。对复合材料抽提残留物的红外分析实验结果表明E-44与PA6／N-PCB复合材料中PA6以及N-PCB粉末表面发生了化学键合。添加1.25份E-44的PA6／N-PCB复合材料与纯PA6相比，其拉伸强度、拉伸模量、弯曲强度和弯曲模量最大增幅分别为 29%、49%、73%和72%，热变形温度提高了42.8℃，但其韧性降低。与未加增容剂相比，其拉伸强度、弯曲强度和缺口冲击强度最大增幅分别为 9%、8%和43%，热变形温度提高了9.3℃。 |
| 关键词：环氧树脂（E-44）；尼龙6；废印刷电路板非金属粉；增容 |
| 中图分类号：TQ325 文献标识码：A 文章编号：1009-9212（2011）05-0061-06 |
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| Study on the Mechanical and Heat Distortion Temperature of Polyamide 6／Nonmetals Recycled from Waste PCB Composites Compatibilized by Epoxy Resin（E-44） |
| OUYANG Jie1，LI Yuan1，WANG Xi1，MENG Yong2，SU Sheng-pei 1，2*
（1. College of Chemistry and Chemical Engineering，Key Lab of Sustainable Resources Processing and Advanced Materials，Hunan Normal University，Changsha 410081，China；2. College of Chemistry and Chemical Engineering，Recycling Integrated Technology Research Center，Hunan Normal University，Changsha 410081，China） |
| Abstract：Polyamide 6（PA6） matrix composites，reinforced with nonmetals recycled from waste printed circuit boards（N-PCB）and compatibilized with epoxy resin（E-44），was prepared by the melt blending method. The effects of E-44 dosage，extrusion temperature and N-PCB particle sizes on the mechanical properties and heat distortion temperature of PA6／N-PCB composites were investigated. The results showed that there were chemical reactions occurred between the components of PA6／N-PCB composites，proved by both FT-IR analysis and the extraction experiment. The maximum increment of tensile strength，tensile modulus，flexural strength and flexural modulus of the PA6／N-PCB composites were 29%，49%，73% and 72%，respectively，compared to that of pure PA6 while the heat distortion temperature increase by 42.8℃. However，the toughness of the composites was decreased. The tensile strength，flexural strength，impact strength and heat distortion temperature of PA6／N-PCB composites increased by 9%，8%，43% and 9.8℃，respectively，comparing to that without compatibilizer-E44.
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| Key words：epoxy resin（E-44）；polyamide 6；nonmetals recycled from waste PCB；compatibilization |
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基金项目： 湖南师范大学潇湘学者启动资金资助课题（化050613）。
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作者简介：欧阳杰（1987-），男，湖南株洲人，硕士研究生，研究方向：高分子复合材料。（E-mail：hnpjieouyang@gmail.com）
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联 系 人： 苏胜培，教授，博士生导师。（E-mail：sushengpei@gmail.com）
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收稿日期： 2011-08-3
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