第 52 卷第 5 期Vol. 52 No. 5
2022 年 10 月Oct 2022

所属栏目:功能材料

聚醚型聚氨酯树脂制备纳米银的研究
邹丽红 (中海兴发(广东)安全技术服务有限公司,广东 广州 510620)
摘 要:以硝酸银和聚醚型聚氨酯树脂制备一种能用于配置网印沉铜催化剂油墨的银树脂。实验通过开路电位-时间法讨论不同的硝酸银用量、银树脂层厚度、银树脂的干燥温度和化学镀铜温度对银树脂催化化学镀铜活性的影响。结果表明:当硝酸银浓度为0.09、烘烤温度为90 ℃、化学镀温度为40 ℃时,制备的银树脂催化活性较好。通过XRD显示银树脂催化化学镀铜后化学镀铜层为面心立方结构,镀层中绝大部分为Cu和少量Ag、Cu2O和CuO夹杂量很小。在红外光谱和紫外光谱表征下,银树脂中银离子与聚氨酯树脂成键的形式是Ag+与-NHCOO-基团中N、O形成稳定的配位键。通过扫描电镜SEM和能谱分析EDS观察,硝酸银在银树脂表面较密且均匀地分布,其粒径极细小,其形状各异,有块状、长条状和点状。
关键词:聚醚型聚氨酯树脂;化学镀铜;纳米银;活化
中图分类号:TQ323.8  文献标识码:A  文章编号:1009-9212(2022)05-0075-06
Preparation of Nano-silver from Polyether Polyurethane Resin
ZOU Li-hong (Zhonghai Xingfa (Guangdong) Safety Technology Service Co., Ltd., Guangzhou 510620, China)
Abstract:The silver resin was prepared from silver nitrate and polyester polyurethane resin, and used in copper catalyst configuration screen printing ink. The effects on silver resin catalyst activity of chemical copper plating from different amount of silver nitrate, silver resin layer thickness, silver resin drying temperature, and copper plating temperature were discussed. The results showed that the prepared silver resin had the best catalytic activity when the concentration of silver nitrate was 0.09, the baking temperature was 90 ℃, and the chemical plating temperature was 40 ℃. The XRD data indicated that structure of copper plating layer was face-centered cubic after reacting by silver resin catalytic copper plating. Most of the coating were Cu but small amount of Ag and very small amount of Cu2O and CuO. The characterization from infrared and ultraviolet spectra indicated that the form of bond of Ag+ and polyurethane resin in silver resin was that Ag+ and N,O in -NHCOO- group formed stable coordination bonds. Silver nitrate in silver resin evenly and uniformly distributed dense observed by scanning electron microscopy SEM and EDS, and had very small particle size, different shapes of massive, strip and dot.
Key words:polyether polyurethane resin; copper plating; nano-silver; activation
作者简介:邹丽红(1986—),女,广东惠州人,安全评价师,研究方向:安全评价(E-mail:3232373523@qq.com)。
收稿日期:2022-05-09