第 53 卷第 1 期 Vol. 53 No. 1 2023 年 2 月 Feb 2023

所属栏目：功能材料 硫代酰胺螯合树脂的吸附特性与电镀废水银回收

王铭剑1，王康杰1，2，刘耀驰1* （1. 中南大学 化学化工学院，湖南 长沙 410083；2. 中芯国际集成电路制造有限公司，北京 100176）

摘　要：电镀废水银吸附回收受共存离子及有机物影响。基于胺基聚苯乙烯（APS）制备了一种胺基和芳环协同的硫代酰胺螯合树脂ATMCR，在银吸附特性研究的基础上，将其应用于电镀废水银回收。采用FT-IR、SEM和BET对合成树脂进行了表征。ATMCR对Ag（I）的吸附属于自发、吸热过程，符合拟二级动力学模型，吸附pH为1~2，318 K时ATMCR的吸附容量达177.6 mg/g。高、低两种浓度电镀废水的处理实践表明，在Cu、Ni和COD共存时，ATMCR的Ag回收率>98%，具备较好的工业应用前景。

关键词：硫代酰胺螯合树脂；银；吸附特性；电镀废水

中图分类号：TQ424　　文献标识码：A　　文章编号：1009-9212（2023）01-0060-07

Adsorption Characteristics of Thioamide Chelating Resin and Its Silver Recovery from Electroplating Wastewater

WANG Ming-jian1, WANG Kang-jie1,2, LIU Yao-chi1* (1. School of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China; 2. SMIC International Integrated Circuit Manufacturing Co., Ltd., Beijing 100176, China)

Abstract：The adsorption and recovery of silver from electroplating wastewater are affected by coexisting ions and organic materials. A thioamide chelating resin ATMCR based on amine polystyrene (APS) was prepared. Based on its silver adsorption characteristics, ATMCR was applied in the recovery of silver from electroplating wastewater. The synthesized resin was characterized using FT-IR, SEM and BET. The adsorption of Ag(I) by ATMCR was a spontaneous and endothermic process, and conformed to the pseudo-second-order kinetic model. Its adsorption capacity reached 177.6 mg/g at 318 K, and the optimal pH range was between 1 and 2. ATMCR was applied to treat electroplating wastewater with high and low concentration. Its recovery rates of Ag were higher than 98% under the coexistence of Cu, Ni and COD. This material has shown a good industrial application prospect.

Key words：thioamide chelating resin; silver; adsorption characteristics; electroplating wastewater

基金项目：湖南省重点领域研发计划（2019KW2031）。

作者简介：王铭剑（1978—），男，湖南邵阳人，高级工程师，博士研究生，研究方向：材料化学工程（E-mail：13924217759@126.com）。

联 系 人：刘耀驰，教授，博士，研究方向：功能材料、环境化学（E-mail：liuyaochi72@163.com）。

收稿日期：2022-09-07